产品详情

详细说明Detailed description：

新式流线型的外观设计，推拉式钢化玻璃门，

使内部维护空间加大。

New-moder streamiline appearance design,

push-pull toughened glass door which enlarges

inner space for maintenance。

直联式入板结构，特制不锈钢链条传输，入板

装置采用与主运输系统一体的结构，保证PCB

板顺利进入输送系统经久耐用。

Direct-link structure for board loading tailor-made stainless chain conveyor, integrating the board-loading equipment to main conveyor for ensuring the PCB loading in conveyor system smoothly,wear well.
预热系统采用远红外发热管,控温采用PID方式、模拟量自动调整电压相角，使温控精度达到±2℃，本预热系统配有特制耐高温钢化玻璃，与远红外红外线发热管组合，可达到理想的无铅焊接预热温度。特殊结构设计，使预热区与焊接区的温度下降值＜5℃。

Adopting infrared heater to preheating system.PID temperature control and auto-adjusted voltage phase by simulation to improve the temperature tolerance up to ±2ºC,This preheating system is equipped with high-temperature proof glass which can achieve perfect lead-free soldering preheating temperature combining with infrared heater.Its special structural design allows the temperature drop from preheating zone to soldering zone less than 5ºC.

PCB输送导轨倾斜角度采用丝杆调整，结构简洁，调节方便。

String-pole adiustmnt for the lean angle of PCB conveyor rail,simple structure,easy to handle。
喷雾系统采用精密型调节阀门进行数字化调节，方便管理，并采用日本专用喷嘴，气缸移动式（步进马达移动式为可选项）。三面抽风过滤系统，助焊剂自动恒压供给系统。可使喷雾流量迅速达到饱和（发泡方式为可选项）。

The spray system is digitally adjusted by the precision adjusting valve, which is convenient for management and adopts the Japanese special nozzle, and the cylinder mobile type (stepping motor movable type is optional). Three-sided air extraction and filtration system, flux automatic constant pressure supply system. Spray flow can be quickly saturated (optional foaming method).

运输系统采用浮动式结构，有效防止导轨变形。

Floating structure for conveyor system to prevent the rail from distortion。
锡炉采用外热板式加热，锡炉内胆材料全部采用特殊不锈钢制作，温度控制采用PID方式，模拟量自动调节电压相角，控温精度达到±2ºC；两波峰近距离设计，完全适合无铅焊接。

Outer-heating mode for solder pot;all the materials inside solder pot are stainless steel;PID temperature control and auto-adjusted voltage phase by simulation to improve the temperature tolerance up to ±2ºC;intimate interval design for waves catering to lead-free soldering。

仪表式操作系统，OMRON PLC作为主控系统，自动识别和调节线路板的长度和宽度，温度控制采用OMRON温控仪表，用自动调节功能来实现PID控温，从而达到稳定的控温和焊接效果。

Meter-type operating system, OMRON PLC as the main control system, automatically identifies and adjusts the length and width of circuit board. Temperature control uses OMRON temperature control instrument, and realizes PID temperature control with automatic adjustment function, so as to achieve stable temperature control and welding effect。

规格 Specifications

GR-300PS	环保无铅波峰焊锡装置	GR-300PS
Conveyor Motor	运输马达	1￠ 220V 60W
Conveyor Speed	运输速度	0.5-1.8m/min
P.C.Board Size	基板尺寸	50-300mm (w)
Air Pressure of Spray Fluxer	松香装置气压	3-5 Bar
Fluxer  volume	松香装置容量	Approx.12Liters
Pre-heater	预加热器1.4M(L)	0.7m 220V 700W*14pcs(Ceramic heater)
Solder Pot Heater	锡炉发热管	220V 1200W*9pcs
Solder  volume	锡炉锡容量	Approx0．450kg
Wave Motor	波峰马达	3￠ 220V 180w×2pcs
Solder Temperature	锡炉温度	Max 300℃
Cooling Fan	冷却风扇	220V  30w
Finger Cleaning Motor	洗爪马达	220V  10w
Soldering angle	焊锡角度	Adjustable 4-6 °
Dimension	机体尺寸	3740(L)*1350(W)*1650(H)mm
Total Power Consumption	总功率	Approx. 23kw
Power Supply	电源	3￠ 380V 50Hz
Net Werght	净重	Approx. 900kg